The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Mar. 23, 1999
Akira Takashima, Kawasaki, JP;
Fumihiko Taniguchi, Kawasaki, JP;
Toshihisa Higashiyama, Kawasaki, JP;
Fujitsu Limited, Kawasaki, JP;
Abstract
A semiconductor device includes an insulating substrate; a semiconductor chip mounted on a front surface of the insulating substrate and provided with electrode pads; bonding pads provided on the front surface of the insulating substrate and electrically connected to the semiconductor chip by means of wires; ball bumps provided on a back surface of the insulating substrate in rows in a grid-like manner; electrode patterns provided in rows on the front surface of the insulating substrate so as to correspond to positions of the ball bumps, respectively, the electrode patterns being connected to the ball bumps through holes formed in the insulating substrate; and interconnection patterns electrically connecting the bonding pads and the electrode patterns. The bonding pads may be provided in a plurality of rows, each of the rows being provided between one of neighboring pairs of rows of the electrode patterns. Alternatively, the bonding pads may be provided in a staggered manner between one of neighboring pairs of rows of the electrode patterns.