The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Oct. 30, 1998
Akira Tanaka, Kawasaki, JP;
Kei Sakamoto, Kawasaki, JP;
Kenichi Ito, Kawasaki, JP;
Yasuhiro Yoneda, Kawasaki, JP;
Kishio Yokouchi, Kawasaki, JP;
Yasuo Naganuma, Kawasaki, JP;
Nippon Zeon Co., Ltd., Tokyo, JP;
Fujitsu Limited, Kanagawa, JP;
Abstract
The invention relates to a photosensitive polyimide resin composition comprising (A) a polyamic acid having, in its main chain, repeating units formed from a polycondensation product of at least one tetracarboxylic acid or tetracarboxylic anhydride thereof with at least one diamine compound, and having actinic ray-sensitive functional groups at both terminals thereof; (B) a photosensitive auxiliary having a photopolymerizable functional group; (C) a photopolymerization initiator; and (D) a solvent, wherein 1 the polyamic acid is such that when the repeating unit represented by the formula (1) is defined as a unit molecular weight, a unit molecular weight per carboxyl group (unit molecular weight/COOH) falls within a range of from 200 to 300, and 2 the photosensitive resin composition permits the formation of a polyimide film having a residual stress of 40 MPa or lower and a coefficient of thermal expansion of 30 ppm/.degree. C. or lower on a substrate, and to said polyamic acid, a polyimide film having excellent film properties, and a pattern forming process using the photosensitive polyimide resin composition.