The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Apr. 05, 1999
Ming-Cheng Tsai, TaoYuan Hsien, TW;
Heng-Chen Ho, Taipei, TW;
VIA Technologies, Inc., Hsin-Tien, TW;
Abstract
A method for performing rework test on integrated circuit (IC) packages is provided. By this method, the first step is to remove a selected part of the casing of the IC package to form an opening in the casing to expose the IC chip contained in the casing. Then, an adhesive layer, such as a double adhesive tape, is attached over the casing on the side where the opening is formed. Then, a heat-insulative cover, such as a ceramic cover, is adhered to the double adhesive tape. After this, the entire IC package is mounted by solder on a test circuit board, allowing a function test procedure to be performed on the internal circuitry of the IC chip contained in the casing. During the function test procedure, when necessary, the ceramic cover can be easily and effortlessly detached to allow the test engineer to visually inspect the inside IC chip for any structural problems.