The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Mar. 06, 1998
Applicant:
Inventors:
Steve V Drehobl, Phoenix, AZ (US);
Joseph D Fernandez, Gilbert, AZ (US);
Mike Charles, Scottsdale, AZ (US);
Assignee:
Microchip Technology, Incorporated, Chandler, AZ (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H05K / ;
U.S. Cl.
CPC ...
438106 ; 438111 ; 438123 ; 438125 ;
Abstract
An integrated circuit package that has the ability for interdevice communication. The integrated circuit package has a first device mounted within the integrated circuit package. A second device is also mounted within the integrated circuit package. The second device is directly coupled to the first device through interdevice bonding for allowing the first device and the second device to communicate and control one another.
Drehobl, Steve. (2000). Integrated circuit package having interchip bonding and method therefor (U.S. Patent No. 6159765). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6159765
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile