The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Feb. 11, 2000
Hiromitsu Kinoshita, Osaka, JP;
Tetsuo Shiraiwa, Osaka, JP;
Hidetaka Uraoka, Shiga, JP;
Nobuo Ochiai, Kyoto, JP;
Dai-Ichi Kogyo Seiyaku Co., Ltd., Kyoto, JP;
Dai-Ichi Ceramo Ltd., Shiga, JP;
Abstract
The object is to provide a powdered metal injection compacting composition adapted to give compacts free from deformation, cracking or blistering without being compromised in compactability or debinder characteristic and without the aid of a special jig. This composition comprises a metal powder and an organic binder comprising (A) a crystalline resin having a melting point of not less than 150.degree. C., (B) an organic compound the weight loss on heating of which begins at a temperature below 150.degree. C. and (C) a composite acrylic resin, the composite acrylic resin mentioned above being a resin obtainable by dispersing a solution comprising the following components (C1).about.(C3) in an aqueous medium containing a dispersant and carrying out a suspension polymerization reaction: