The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 12, 2000
Filed:
Jan. 29, 1999
Applicant:
Inventor:
Hideharu Nakajima, Kanagawa, JP;
Assignee:
Sony Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24D / ;
U.S. Cl.
CPC ...
451527 ; 451550 ; 451551 ;
Abstract
A polishing pad for chemical mechanical polishing capable of simultaneously realizing a reduction of process costs by the reduction of the amount of usage of a polishing slurry and an improvement of a polishing quality of a wafer surface, and a polishing apparatus and a polishing method using the same, provided with a first area A at a side of a predetermined radial line R of the polishing pad in the direction of rotation or advance 30 of the polishing pad, a second area B at an opposite side thereof, and grooves having projecting portions 203 in a direction opposite to the direction of rotation or advance 30 of the polishing pad formed only in the second area B.