The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2000
Filed:
Nov. 05, 1998
Applicant:
Inventors:
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257738 ; 257778 ; 257780 ; 257784 ; 257787 ; 257790 ;
Abstract
A semiconductor device package which eliminates the possibility of damages to a solder connected portion of a flip-chip connected chip by load, or which eliminates ultrasonic output at the time of wire bonding is described. Electrodes of a first chip are connected to first connection pads corresponding to the electrodes with the first chip being bonded at its rear surface to a rear surface of a second chip. A first resin is interposed in a gap between the first chip and a circuit board so as not to cover the first or second connection pads. Thereafter, the electrode of the second chip is connected to the second connection pads by wires, and the whole device is overlayed by a second resin.