The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2000

Filed:

Jun. 30, 1997
Applicant:
Inventors:

James Azotea, Saratoga Springs, NY (US);

Victor A Temple, Clifton Park, NY (US);

Assignee:

Intersil Corporation, Palm Bay, FL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257679 ; 257678 ; 257684 ; 257700 ; 257701 ; 257703 ; 257704 ; 257705 ; 257710 ; 257728 ; 257729 ; 257779 ;
Abstract

A hermetic thin pack semiconductor device. The semiconductor device has a semiconductor substrate and at least one electrode on the upper surface of the semiconductor substrate. A lid of a ceramic material for the semiconductor device has at least one opening extending through the lid. A first electrically conductive material is located on the interior surface of the at least one opening, a second electrically conductive material is located on at least a portion of the upper surface of the lid, and a third electrically conductive material is located on at least a portion of the lower surface of the lid. A solder material is positioned between the electrode and the third electrically conductive material and positioned on a corresponding portion of the electrode opposite a corresponding opening in the lid.


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