The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 05, 2000

Filed:

Aug. 31, 1999
Applicant:
Inventors:

Hiroyuki Tanaka, Osaka, JP;

Hideki Hashizume, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B / ;
U.S. Cl.
CPC ...
219633 ; 1562722 ; 1562733 ; 1562753 ; 156290 ; 257 98 ; 385 93 ;
Abstract

An optical module has a housing of synthetic resin incorporating a lens therein and a semiconductor device of a metal-cap package structure which is held in optical axis alignment with the lens. The optical module is manufactured in provisional and final fixing stages. In the provisional fixing stage, a first thermosetting resin is applied as a plurality of spaced dots to surfaces, to be joined, of a stem of the semiconductor device and an end of the housing, the lens and the semiconductor device are held in optical axis alignment with each other, and a high-frequency current is supplied to a coil extending around the stem to heat the stem to thermoset the first thermosetting resin by high-frequency induction heating. In the final fixing stage, a second thermosetting resin is deposited in a circumferential pattern on an outer circumferential surface of the stem along the end of the housing, and the second thermosetting resin is thermoset by heating.


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