The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2000
Filed:
Jul. 29, 1998
Masaki Morita, Shimodate, JP;
Shin Takanezawa, Shimodate, JP;
Takashi Yamadera, Tsukuba, JP;
Kazumasa Takeuchi, Yuki, JP;
Shuuichi Hatakeyama, Shimotsuma, JP;
Hitachi Chemical Company, Ltd., Tokyo, JP;
Abstract
A resin composition which can be cured by application of heat or irradiation of light, comprising (A) a bismaleimide compound, (C) an acridine compound represented by the formula (1) or (2) as an thermosetting accelerator or a photo-polymerization initiator, and (B) an optional resin ingredient other than (A); a film and laminate produced by using the resin composition; and a method of producing a multilayer wiring board by using the resin composition as a material of insulating layers: ##STR1## wherein R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.7, R.sub.8 and R.sub.9 are hydrogen, a halogen, an alkyl or alkoxy group, R.sub.1 is an alkyl group, and R.sub.10 is an alkylene group.