The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 05, 2000
Filed:
Oct. 25, 1996
Sam G Geha, Sunnyvale, CA (US);
Ende Shan, Pleasanton, CA (US);
Cypress Semiconductor Corporation, San Jose, CA (US);
Abstract
A wetting layer is formed on a substrate at a relatively high process temperature (e.g., the temperature of the substrate and/or the temperature within a process chamber in which the wetting layer is formed). A metallization layer that is subsequently formed on the wetting layer adheres to the wetting layer better than the metallization layer would adhere to the wetting layer if the wetting layer was formed at a lower process temperature. The high process temperature causes the density of the wetting layer to be increased, so that, consequently, the wetting layer has a smoother surface to which the metallization layer can adhere.