The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2000
Filed:
Dec. 07, 1999
Joe Luis Martinez, Jr, Phoenix, AZ (US);
Pablo Rodriguez, Gilbert, AZ (US);
Martin Aaron Kalfus, Scottsdale, AZ (US);
Motorola, Inc., Schaumburg, IL (US);
Abstract
An electronic assembly (20) having an insulated metal heat sink (10) and a method of manufacturing the electronic assembly (20). The electronic assembly (20) has a heat dissipater (11), a dielectric material (12), and a conductive layer (13). A semiconductor chip (21) is attached to the insulated metal heat sink (10). Heat generated by the semiconductor chip (21) is conducted to the conduction surface (14) of the heat dissipater (11). In one embodiment a convection surface (16) of the heat dissipater (11) is present and the heat is transferred from the convection surface (16) of the heat dissipater (11) to a fluid by convection. The fluid is directed by a manifold (64).