The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2000

Filed:

Jul. 15, 1997
Applicant:
Inventors:

Seishi Irie, Kanagawa-ken, JP;

Takahiro Sato, Oita-ken, JP;

Assignee:

Kabushiki Kaisha Toshiba, Kawasaki, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257775 ; 257750 ; 257758 ;
Abstract

An object of the present invention is to provide a semiconductor device where a metal wiring pattern is improved in order to prevent photoresist foaming from occurring without employing a special process, even if a protective layer void occur in a wire to wire space in the metal wire, and an arrangement method for a semiconductor device pattern. To achieve the above object, the present invention provides a semiconductor device comprising a first wiring layer and a second wiring layer arranged in a row on a semiconductor substrate, and a insulating layer on the first wiring layer and the second wiring layer so that a first portion of the insulating layer on the first wiring layer is prevented from touching a second portion of the insulating layer on the second wiring layer.


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