The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 28, 2000

Filed:

Mar. 25, 1999
Applicant:
Inventors:

Hiroshi Shimizu, Yuki, JP;

Nobuyuki Ogawa, Tsukuba, JP;

Katsuji Shibata, Shimotsuma, JP;

Akishi Nakaso, Oyama, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; C23C / ; B23F / ;
U.S. Cl.
CPC ...
430314 ; 427207 ;
Abstract

An etching solution comprising (A) an amine as a solvent, (B) an alkali metal compound, and (C) an alcohol as a solvent, this etching solution being a non-aqueous solution. This etching solution is-effective for etching a cured epoxy resin layer for forming holes for interstitial via holes having a small diameter, in the production of a multilayer printed circuit board. This etching solution is particularly effective for etching a cured epoxy resin layer formed from a thermosetting epoxy resin composition including (a) an epoxy resin, (b) a crosslinking agent, and (c) a polyfunctional epoxy resin, which forms a thermosetting copper-clad adhesive resin sheet which covers an interlayer circuit plate of a multilayer printed circuit board.


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