The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2000
Filed:
Dec. 09, 1998
Hidekazu Oohashi, Shizuoka-ken, JP;
Koichi Kawamura, Shizuoka-ken, JP;
Tadahiro Sorori, Shizuoka-ken, JP;
Morio Yagihara, Shizuoka-ken, JP;
Sumiaki Yamasaki, Shizuoka-ken, JP;
Fuji Photo Film Co., Ltd., Minami-Ashigara, JP;
Abstract
A planographig printing plate precursor which can be written by heat mode exposure of low energy, has excellent strength in image portions and blemishing resistance, can be developed with water, or can be installed in a printing machine as it is for conducting printing without requiring specific treatment such as wet developing treatment, rubbing and the like after writing of an image, and a method for producing the same, are provided. The planographic printing plate precursor of the present invention is obtained by laminating on a substrate having a hydrophilic surface a layer composed of a hydrophobic polymer which is made hydrophilic by heating and either a layer composed of a hydrophilic polymer compound having in the side chain at least one of alkylene oxide groups or functional groups selected from --COOR, --COOM, --SOR, --SO.sub.2 R, --SO.sub.3 R, --SOM, --SO.sub.2 M, --SO.sub.3 M, --OH, --NR.sup.22 R.sup.23 (wherein, R represent a hydrogen atom, alkyl group or aryl group, M represents a metal atom, R.sup.22 and R.sup.23 each independently represent a hydrogen atom, alkyl group or aryl group) or a layer of which exposed portions can be removed by heat mode exposure.