The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 21, 2000

Filed:

Apr. 30, 1997
Applicant:
Inventors:

Jae Woo Park, Seoul, KR;

Sang Hyun Kim, Chungcheongbuk-do, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05C / ;
U.S. Cl.
CPC ...
118712 ; 118666 ; 118725 ; 118728 ; 118729 ;
Abstract

A semiconductor manufacturing device uniformly grows a film on the surface of a wafer and reduces a turnaround time by shortening the time per process unit. The device includes a chamber, a plurality of lamps disposed on the upper end of the chamber to heat the wafer, and a plurality of pyrometers for supporting the wafer inserted into the wafer, detecting the inner temperature of the chamber and supporting the wafer onto a heat board as the wafer is heating to a predetermined temperature. The device further includes the heat board disposed on the lower end of the chamber to hold thereon the wafer lowered by the pyrometers and to keep the processing temperature, a wafer inlet or outlet formed on one side of the chamber, and reaction gas inlet and outlet formed on both sides of the chamber for injecting the reaction gas for growing the film on the wafer as the wafer is lowered onto the heat board.


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