Printed circuit assembly having locally enhanced wiring density

Abstract

A printed circuit assembly and method of making the same facilitates the attachment of high density modules onto a printed circuit board. In one embodiment, the high density modules are attached to the printed circuit board using an adhesive having a conductive material disposed within at least one via. In an alternate embodiment, an adhesive layer including a plurality of non-conductive 'gauge particles' disposed within a non-conductive adhesive is used to attach the module to the printed circuit board. When the adhesive layer is disposed between a module and a printed circuit, individual gauge particles are interposed or sandwiched at various points between the layers such that the diameters of the particles control the layer separation throughout overlapping areas of thereof, thereby permitting careful control over layer separation. A printed circuit assembly and method of making the same utilize in another embodiment an interlayer interconnecting technology incorporating conductive posts that are deposited on one of a pair of contact pads formed on a module that opposes a printed circuit board and is thereafter bonded to the other in the pair of contact pads during lamination. Fusible material may be utilized in the conductive posts to facilitate mechanical bonding to a contact pad, and the posts project through a dielectric layer disposed between the printed circuit boards, thereby forming the electrical connections between the boards at discrete locations. The conductive posts may also comprise a conductive ink.