The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

Jun. 21, 1999
Applicant:
Inventors:

Varinder K Kalra, Chesterfield, MO (US);

Keith A Spalding, Fenton, MO (US);

Assignee:

Cooper Technologies Company, Houston, TX (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H / ; H01H / ; H01H / ;
U.S. Cl.
CPC ...
337248 ; 337232 ; 337227 ; 337186 ; 337228 ; 29623 ;
Abstract

A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations close the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded. One of a solder and brazing preform bond the fuse element to the end terminations.


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