The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

Mar. 23, 1999
Applicant:
Inventors:

Mark T Girard, South Haven, MN (US);

Ryan A Jurgenson, Hutchinson, MN (US);

Assignee:

Applied Kinetics Inc., Hutchinson, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G11B / ;
U.S. Cl.
CPC ...
430319 ; 430311 ; 430945 ; 2960303 ; 2960307 ; 3602458 ; 21912185 ;
Abstract

The present invention provides a method for the creation and removal of shunts for the prevention of ESD/EOS damage to electrical components. In one embodiment of the present invention, the conductive pathway is provided and removed by exposing the interconnect's carbonizable and ablatable substrate to a radiant energy source such as a laser beam. The present invention also provides for interconnects that include at least two conductive wires or leads engaged on at least one surface by a carbonizable and ablatable material. The conductive wires may each include a branched dead end lead portion interleaved with the branched dead end lead portion of the other. Alternatively, the conductive wires may extend in close proximity to each other in a curved or sinuous or serpentine or backtracking pattern. An interconnect in accord with the present invention may include a substrate substantially supporting the conductive wires except at predetermined locations or proposed shunt sites wherein there is at least one through hole in the substrate.


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