The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

May. 28, 1997
Applicant:
Inventors:

Junji Yoshii, Ibaraki, JP;

Hajime Tsukamoto, Ibaraki, JP;

Yoshihiro Matsukura, Ibaraki, JP;

Hisanori Tobita, Ibaraki, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29D / ;
U.S. Cl.
CPC ...
428 359 ; 428 349 ; 428 367 ; 428483 ; 4284758 ; 428518 ;
Abstract

The invention provides a heat-shrinkable multi-layer film comprising at least a thermoplastic resin layer as the outermost layer (A), a gas barrier resin layer as a core layer (B) and a sealing resin layer as the innermost layer (C), and optionally an adhesive layer between the individual layers, wherein (1) the sealing resin layer of the innermost layer (C) is a layer formed of a resin material (b) comprising a linear ethylene-1-octene copolymer (a) obtained by using a constrained geometry catalyst and having an 1-octene content not lower than 1 wt. % but lower than 20 wt. % and a density higher than 0.885 g/cm.sup.3 but not higher than 0.960 g/cm.sup.3, and (2) an intermediate layer (D1) formed of at least one resin (c) selected from the group consisting of polyamide resins, thermoplastic polyester resins and ethylene copolymer resins is provided between the outermost layer (A) and the core layer (B). The film has excellent sealing properties, clarity, mechanical strength, stretchability and bag-making property.


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