The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

Mar. 12, 1999
Applicant:
Inventors:

Michael A Centanni, Parma, OH (US);

Mark Kusner, Gates Mills, OH (US);

Assignee:

GA-TEK Inc., Eastlake, OH (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ;
U.S. Cl.
CPC ...
156151 ; 1562726 ; 1562739 ; 1562755 ; 1562757 ; 29830 ; 428 418 ; 4284735 ; 428901 ;
Abstract

Method of forming a flexible circuit laminate for use in the production of flexible circuits, comprising the steps of electrodepositing a continuous layer of copper on a first side of a generally continuous strip of polyimide having a layer of metal on the first side, modifying a second side of the polyimide strip to increase the surface energy thereof, applying a preformed adhesive film on the second side of the generally continuous strip of polyimide, the adhesive strip being formed of a substantially uncured polymeric material, and curing the adhesive film wherein at least the outmost layer of the adhesive film is only partially cured.


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