The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 14, 2000

Filed:

Feb. 05, 1999
Applicant:
Inventor:

Duane A Preszler, Riverfalls, WI (US);

Assignee:

Eastman Kodak Company, Rochester, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03D / ;
U.S. Cl.
CPC ...
396575 ; 355 27 ; 355400 ; 396579 ; 34639 ;
Abstract

An apparatus and method for cooling a thermally processed, imaging material which has been heated to a first temperature by a thermal processor is disclosed. The cooling apparatus includes a cooling article, on which the imaging material rides after the imaging material exits the thermal processor, and an imaging material transport mechanism. The cooling article is at a lower temperature than the first temperature to cool the imaging material. The transport mechanism conveys the imaging material over the cooling article. The imaging material transport mechanism includes a first roller, a second roller and a displacement mechanism. The displacement mechanism effects relative movement between the first and second rollers between a first position and a second position. In the first position, the first and second rollers engage the imaging material to convey the imaging material over the cooling article. In the second position, The imaging material is substantially freely movable relative to the first and second rollers. By allowing the imaging material to move freely relative to the first and second rollers prior to the imaging material substantially exiting the thermal processor, imaging material defects during cooling are minimized.


Find Patent Forward Citations

Loading…