The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2000
Filed:
Mar. 24, 1999
Applicant:
Inventors:
Jay DeAvis Baker, W. Bloomfield, MI (US);
Mohan R Paruchuri, Canton, MI (US);
Prathap Amerwai Reddy, Farmington Hills, MI (US);
Vivek Amir Jairazbhoy, Farmington Hills, MI (US);
Assignee:
Visteon Corporation, Dearborn, MI (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01K / ; H01K / ;
U.S. Cl.
CPC ...
257783 ;
Abstract
A product for attaching an electronic component, such as a semiconductor die, to a substrate includes a relatively low-melting-temperature solder preform applied to the substrate; and a bead of a curable bonding material applied to the substrate around the periphery of the solder preform in an amount sufficient to substantially contain the solder material and bridge the gap between the die and the substrate upon a subsequent collapse of the solder preform along its thickness dimension.