The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2000
Filed:
Aug. 31, 1998
Applicant:
Inventor:
Tetsuro Washida, Tokyo, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257693 ; 257737 ; 257738 ; 257778 ; 257780 ; 257786 ; 257777 ; 257773 ; 257690 ; 257691 ; 257692 ; 257697 ; 257730 ;
Abstract
A semiconductor device comprising a plurality of bump electrodes wherein signal pins requiring electrical connection are assigned in sequence from the bump electrodes at the outermost periphery near the edge of the semiconductor device to the bump electrodes in an interior area of the semiconductor device, and no-connection pins requiring no electrical connection are assigned to the remaining bump electrodes, is provided. Circuit board cost is thus reduced, and the ease of mounting the semiconductor device to the circuit board is improved.