The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 07, 2000
Filed:
Jul. 10, 1998
Toshio Nakamori, Ashiya, JP;
Masashi Yamamoto, Tokyo, JP;
Tamotsu Toki, Nishinomiya, JP;
Hirohito Masumoto, Wakayama, JP;
Mutsuo Sagara, Wakayama, JP;
Hiroo Maeda, Kitakyushu, JP;
Sumitomo Metal Industries, Ltd., Osaka, JP;
Abstract
A batchwise hot dip plating method is performed by dipping a metallic material in a molten metal plating bath, following fluxing by dipping the metallic material in a bath of a fused salt flux (e.g., a mixture of cryolite and one or more alkali metal chlorides and optionally aluminum fluoride) having a melting temperature at least 5.degree. C. higher than the temperature of the molten metal plating bath, which also serves to preheat the metallic material. In the case of hot dip plating with an Al--Zn alloy, particularly a Zn/55% Al/0.5-2% Si alloy, a bare spot-free plated coating having good appearance can be formed by a reduced duration of dipping in the plating bath without post-plating treatment to remove flux residues. The use of a plating tank having a cross section of a round shape such as a semicircular shape or an oblong semielliptic shape, rather than a rectangular box shape, brings about a significantly extended service life of the plating tank.