The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
May. 28, 1999
Fuminori Nakashima, Yokkaichi, JP;
Naoyuki Kawazoe, Hashima, JP;
Shoichiro Emmei, Nagoya, JP;
Yasuhiro Mizutani, Inabe-Gun, JP;
Hidekazu Hattori, Nagoya, JP;
Satoru Kadowaki, Mie-Gun, JP;
Kazutaka Suzuki, Toyota, JP;
Denso Corporation, Kariya, JP;
Abstract
There is provided a hologram with excellent heat resistance. The hologram comprises a hologram film (10) in which a diffraction grating has been recorded, a substrate (11) situated on one side of the hologram film (10) via a bonding material (13), and a polymer film (12) situated on the other side of the hologram film (10) via a bonding material (13), wherein the thickness of the polymer film (12) is no greater than 100 .mu.m. Otherwise, the polymer film (12) is subjected to prior heat treatment. There is further provided a production process for holograms with minimal appearance defects. The process comprises preparing a photopolymer (210) coated onto a substrate (211) and affixing the photopolymer surface (301) onto a photographed object original (213), exposing it to laser light to converting it into a hologram (201), then releasing the hologram (201) from the photographed object original (213) to expose the hologram surface (302) and finally affixing a protective film (215) onto the hologram surface (302), such that the bonding strength A between the substrate (211) and the hologram (201) is greater than the bonding strength B between the hologram (201) and the protective film (215).