The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
Dec. 03, 1997
Mitsubishi Electronics America, Inc., Cypress, CA (US);
Abstract
An electrically grounded semiconductor structure is embedded in a non-conductive packaging material, without employing any electrical leads of the semiconductor structure as an electrical path and without damaging the semiconductor structure. The desired grounding connection is obtained by physically removing a portion of the non-conductive packaging material from a rear portion of the semiconductor structure, replacing the removed non-conductive material by a conformable electrically conductive material, and then electrically contacting this conformable electrically conductive material to a grounding element. In another aspect of the invention, a portion of the non-conductive packaging material is removed from a rear portion of the semiconductor structure and a metallic element such as a pin or a spring is disposed to make contact between the exposed portion of the semiconductor structure and the grounding element.