The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
Feb. 12, 1999
Kevin A McCullough, Warwick, RI (US);
Chip Coolers, Inc., Warwick, RI (US);
Abstract
A method of molding a thermally conductive article for transferring heat from a heat generating surface is provided. A mold assembly is first provided which is capable of forming an article of a desired configuration. The initial location of contact on the article with the heat generating surface is then determined. An input gate is formed in the mold assembly at the initial location of contact. The optimum heat flow path through the article is determined. A termination location of the heat flow path is determined. Polymer, loaded with conductive filler, is introduced into the mold assembly via the input gate. Venting is provided in the mold assembly at the termination location of the heat flow path. Polymer is positioned in the mold assembly with the conductive filler being substantially parallel and aligned with the heat flow path. Finally, the molded article is ejected from the mold assembly. With the molding method of the present invention, thermal conductivity of articles may be increased several times over the thermal conductivity realized with conventional molding methods.