The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
Jun. 01, 1999
Shoichi Inaba, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
A wafer polishing apparatus includes a rotatably supported polishing table, a pad, a carrier head, and a backing pad. The pad is fixed to the polishing table. The carrier head is arranged to oppose the polishing table and is supported to be rotatable and movable forward/backward with respect to the polishing table. The backing pad is fixed to a surface of the carrier head which opposes the polishing pad, and presses a wafer against the polishing pad by cooperation with compressed air. The backing pad is constituted by an annular foamed body having closed cells to press an outer peripheral portion of the wafer, and a columnar second foamed body having open cells and provided inside the first foamed body.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile