The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 2000
Filed:
Oct. 30, 1998
Applicant:
Inventors:
Masaru Kanno, Miyagi, JP;
Shinji Sasaki, Miyagi, JP;
Yoshiaki Atani, Miyagi, JP;
Toshihiro Saito, Miyagi, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
228 37 ; 228 35 ; 228 14 ; 228260 ;
Abstract
An automatic soldering mechanism is for jetting a solder jet flow to a printed-circuit board to carry out a soldering of the printed-circuit board. The automatic soldering mechanism comprises a solder tank for storing a molten solder and a solder jetting nozzle section for jetting the solder jet flow higher than a melt surface of the molten solder within the solder tank in an inert gas atmosphere.