The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2000
Filed:
May. 10, 1999
Sang Wook Park, Kyoungki-do, KR;
Sung Bum Park, Seoul, KR;
Hyundai Electronics Industries Co., Ltd., Kyoungki-do, KR;
Abstract
Disclosed is a chip stack package having a remarkably short interconnection paths between the semiconductor chips and external device, and between the respective semiconductor chips. The chip stack package comprises: at least two semiconductor chips disposed in series vertically in the package, wherein bonding pads are disposed at both sides of the respective semiconductor chips and vertically open slots are formed in the bonding pads; lead frames inserted into the slots of the respective semiconductor chips so as to electrically connect the respective bonding pads; and an epoxy compound for molding the resultant structure entirely so as to expose an interconnection portion of the respective lead frames.