The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 24, 2000

Filed:

Dec. 16, 1998
Applicant:
Inventors:

Haruhisa Maruyama, Nakakoma-gun, JP;

Jiro Fujimori, Nakakoma-gun, JP;

Masaaki Motokawa, Nakakoma-gun, JP;

Assignees:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
1562735 ; 1562755 ;
Abstract

A method of producing an optical disc of bonded type includes the processes of: (A) forming a first reflection film, which is half transparent for partially reflecting and partially transmitting an incident light, on a first information record surface of a first transparent substrate; (B) forming a second reflection film, which has a reflective index higher than that of the first reflection film, on a second information record surface of a second transparent substrate; (C) dripping a liquid resin of ultraviolet hardening type onto one of the first and second reflection films by a spin coating method to form a first resin layer in a non-hardened condition; (D) dripping a liquid resin of ultraviolet hardening type onto the other of the first and second reflection films by a spin coating method; (E) emitting ultraviolet onto the liquid resin dripped by the process (D) to form a second resin layer of ultraviolet hardening type in a hardened condition; (F) provisionally bonding the first and second transparent substrates together in a pressure reduced environment; and (G) hardening the first resin layer by emitting ultraviolet from a side of the first transparent substrate.


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