The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 24, 2000
Filed:
Feb. 09, 1999
Takao Shimizu, Nagoya, JP;
Noboru Yamamoto, Nagoya, JP;
Shigeyuki Inagaki, Nagoya, JP;
Hiroaki Suzuki, Nagoya, JP;
Abstract
In a metal material bonding method, an insertion material, which has a lower melting point than that of metal materials to be bonded, is interposed between bonding end surfaces of the metal materials to be bonded. The metal materials to be bonded is heated and held to a temperature not lower than the melting point of the insertion material and not higher than the melting point of the metal materials to be bonded while applying pressure to bonding surfaces of the metal materials to be bonded. The insertion material is formed to have a size which is smaller than each of the bonding surfaces of the metal materials to be bonded.