The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Jul. 28, 1999
Eric Lee Goldner, Valencia, CA (US);
Gary Thomas Griffin, Millican, TX (US);
Litton Systems, Inc., Woodland Hills, CA (US);
Abstract
An assembly module provides well-organized optical fiber component attachment features and convenient fiber routing areas for assembling and containing a fiber optic device such a telemetry module. The module comprises a first substrate having a first side and a second side. The first side includes a plurality of sidewalls and a recessed floor surface bounded by the sidewalls. Some of the sidewalls have a cavities formed therein. A plurality of channels extend from the ends of the cavities. A plurality of projections extend from the sidewalls over selected portions of the floor surface such that a lower edge of each projection is spaced apart from the floor surface. Optical fiber components (couplers, splices, etc.) may be mounted in the cavities, and optical fibers are routed to and from the optical fiber components on regions between the sidewalls and through the channels. The optical fibers are placed in the spaces between the projections and the floor surface to retain the optical fibers in selected positions. The assembly module provides for preasembled, pretested, mass produced, fiber optic coupler and excess fiber subassemblies and reduces the potential for component and fiber damage during manufacturing and allows for, but reduces the need for, the potential rework and repair associated with errors and failures during array assembly, thereby reducing manufacturing cost.