The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Dec. 08, 1999
Loyalty Founder Enterprise Co., Ltd., Taoyuan, TW;
Abstract
A winding chain dissipating unit suitable for an electronic device is disclosed. The winding chain dissipating unit has a winding chain outer tube, a winding chain inner tube, and heat pipe within the winding chain inner tube. The inner diameter of the winding chain outer tube is matched with the outer diameter of the winding chain inner tube so as to have a smaller front end and a larger rear end. Moreover, an elastic element is installed at a position between the front end of the winding chain inner tube and the front wall of the winding chain outer tube so that the winding chain inner tube generates a continuously front pulling force to the winding chain outer tube. Once a wear from rotation friction therebetween is formed, the winding chain inner tube will move forwards gradually so as to automatically adjust and compensate the gap from the wear. That is, the outer diameter of the winding chain inner tube tightly contacts with the inner diameter of the winding chain outer tube until the stopping ring ejects against the rear wall of the winding chain outer tube so as not be adjusted again. As a result, the winding chain dissipating block formed by two winding chain dissipating units can be applied to a pivotal portion between the mainframe seat of a notebook computer and a screen seat. Thus, the heat emitting from the microprocessor within the mainframe seat can be transferred effectively to the radiating aluminum plate of the screen seat and thus, heat is transferred effectively.