The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Jan. 26, 1998
Junichi Asada, Kawasaki, JP;
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Abstract
A semiconductor device comprises a semiconductor chip having a major surface, a plurality of bonding pads provided on the major surface of the semiconductor chip, an adhesive tape provided on a selected part of the major surface of the semiconductor chip, and a plurality of inner leads mounted on the adhesive tape, each adhered at a lower surface thereof to the adhesive tape. The device further comprises a wiring lead, bonding wires, and a resin-molded package. The wiring lead has at least one end portion and spaced apart from the major surface of the chip. The at least one end portion is depressed from the inner leads toward the semiconductor chip, located outside the adhesive tape and formed integral with at least one of the inner leads. The bonding wires are spaced apart from the wiring lead and connected, at one end, to upper surfaces of the inner leads other than the inner lead which is formed integral with the at least one end portion of the wiring lead, and at the other end, to the bonding pads which are provided on the chip. The resin-molded package encapsulates the semiconductor chip, the adhesive tape, the inner leads, the wiring lead and the bonding wires.