The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Apr. 28, 1999
Applicant:
Inventor:
Tomoo Murakami, Tokyo, JP;
Assignee:
NEC Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438108 ; 438118 ;
Abstract
A method of mounting a semiconductor element on a substrate and a semiconductor device formed therewith, includes forming mounting pads on the substrate, roughening a surface of at least one of the pads, positioning a resin between a semiconductor element having electrodes formed thereon and the substrate, and connecting roughened surfaces of the pads to the electrodes, respectively.