The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2000
Filed:
Mar. 13, 1998
Noboru Mohri, Osaka, JP;
Hayami Matsunaga, Osaka, JP;
Masaaki Hayama, Nara, JP;
Tomitarou Murakami, Osaka, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.