The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2000
Filed:
Jun. 17, 1998
Yuji Kaneko, Kanagawa, JP;
Tatsuo Toyonaga, Kanagawa, JP;
Daisuke Sadamitsu, Kanagawa, JP;
Tatsuo Kuloda, Kanagawa, JP;
Sodick Co., Ltd., Kanagawa, JP;
Abstract
A wire-cut EDM method and apparatus for machining to a fine surface roughness of 1 .mu.m Rmax or less. Two power supplies and a electrode polarity switching system are used. A first high energy power source is used for initial profile cutting and may also be used for one or more later cuts while the machining pulse parameters, and feed rate and offset are adjusted for increasing less rough surface finishes. The wire electrode is held at negative machining potential. A second power supply and smaller offset values are used for later cuts to create lower values of surface roughness, while still maintaining the wire electrode at a negative machining potential. Finally, in order to create a fine finished surface (Rmax.ltoreq.1 .mu.m), the offset is further reduced and the wire electrode polarity is reversed.