The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 2000

Filed:

Sep. 10, 1998
Applicant:
Inventors:

M Ishaq Haider, Bernardsville, NJ (US);

John Anthony Flint, Berkeley Heights, NJ (US);

Michael Jaffe, Maplewood, NJ (US);

John Edward Cornetta, Chester, NJ (US);

Joseph J DiBiase, Nazareth, PA (US);

Assignee:

Celanese Acetate LLC, Charlotte, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
D01D / ; D01D / ;
U.S. Cl.
CPC ...
2642108 ; 26421112 ; 26421117 ;
Abstract

The present invention discloses and claims a novel process for the heat treatment of high denier filaments of a thermotropic liquid crystalline polymer. Preferred embodiments include process for the formation of heat treated filaments of a few wholly aromatic polyesters and polyesteramides. The process involves: (a) heating of a thermotropic liquid crystalline polymer to above its melting transition temperature; (b) passing said molten polymer through an extrusion chamber equipped with an extrusion capillary of an aspect ratio of greater than about 1 and less than about 15 to form a filament; (c) winding the filament on to a bobbin at a low tension and draw-down ratio of at least about 4; and (d) heat treating the filament directly on the bobbin at suitable temperature and pressure conditions for a sufficient period of time. The filaments so formed are of at least 50 denier per filament (dpf) and feature essentially uniform molecular orientation across the cross-section. The heat-treated filaments feature remarkably good tensile properties retaining at least 80 to 90 percent of the properties expected of conventional low denier (5 to 10 dpf) filaments.


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