The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 10, 2000
Filed:
Aug. 07, 1998
Toyoda Gosei Co., Ltd., Aichi, JP;
Abstract
A heat-resistant molded instrument panel article having a decorative appearance, produced at a relatively low cost, wherein the instrument panel article comprises a main body molded from a first synthetic resin, a section piece molded from a second synthetic resin such that the periphery of the section piece is partially or entirely surrounded by the main body, with the upper outer surface of the section piece abutting the upper outer surface of the main body, so that such surfaces form a single, level surface. A surface layer continuously covers the surface of the section piece and at least part of the surface of the main body. The main body is made of a first synthetic resin having an elastic modulus in flexure in a range of about 2,000 MPa to about 4,000 MPa and a coefficient of linear thermal expansion of about 3-12.times.10.sup.-5 .degree. C..sup.-1. The section piece is made of a second synthetic resin having an elastic modulus in flexure in a range of about 100 MPa to 700 MPa and a coefficient of linear thermal expansion of about 1-10.times.10.sup.-5 .degree. C..sup.-1. The surface layer is made of a third synthetic resin having an elastic modulus in flexure ranging from about 300 MPa to about 2,000 MPa and a coefficient of linear thermal expansion of about 3-12.times.10.sup.-5 .degree. C..sup.-1.