The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2000
Filed:
Aug. 03, 1998
Ellis D Harris, Claremont, CA (US);
Other;
Abstract
An electronics module consists generally of a refractory metal sheet coated with a refractory insulator film which in turn is coated with a film of silicon within which thin film transistor electronics circuits are further generated along with interconnection means. Particulate matter is deposited in a desired pattern by a printing process and then fused into smooth thin films by means of an infrared laser. Insulator particles are first deposited onto the refractory metal sheet and then melted and fused into a smooth film adhered to the metal sheet. Silicon particles are next deposited on the insulator film and melted and crystallized into electronic quality silicon film. TFT electronics are next generated in the silicon by well-known means. A plurality of individual modules can be disposed in patches over an extended area both conserving material and providing mechanical flexibility as required by certain applications. Additionally, a plurality of individual modules can be arranged in a stack together with interconnection and cooling means resulting in a three-dimensional VLSI integrated circuit.