The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2000
Filed:
Oct. 29, 1998
Applicant:
Inventors:
Assignees:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Fujikoki Corporation, Tokyo, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257419 ; 257420 ;
Abstract
A semiconductor pressure detecting device comprises a package having a pressure introducing hole; a base plate which has a first through hole and is mounted in the package; a base mounted on the base plate; and a semiconductor pressure sensor chip which is mounted on the base; wherein the base plate has a thickened portion formed around the first through hole and is fixed by welding the circumference of the thickened portion onto the package.