The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2000
Filed:
Nov. 13, 1998
Gerhard Troetscher, Weissensberg, DE;
Josef Krill, legally incapacitated, Siegburg, DE;
Ernst-Dieter Grafe, Troisdorf, DE;
Lindauer Dornier Gesellschaft mbH, Lindau, DE;
Abstract
A method of cooling hot-pressed panels, such as wood chip or fiber board panels or sheets, includes a first step in which the panels are intensively cooled from an initial temperature above 100.degree. C. down to a temperature of about 100.degree. C. by means of cooling water, a second step in which the panels are further cooled to a temperature below 60.degree. C. by using cooling air, and a third step of reconditioning the panels by exposing the panels to a vapor mixture of steam and volatile binder components that was evolved during the first step. The third reconditioning step can begin and take place already during the first cooling step, or between the first and second cooling steps. An apparatus for carrying out the method includes a hot press apparatus, a first cooling arrangement for applying cooling water to the panels, a second cooling arrangement for applying cooling air to the panels, a reconditioning zone for exposing the panels to a vapor mixture arising during the first cooling step, and a conveyor device for transporting the panels through the apparatus. In this manner, the total time required for cooling the panels is substantially reduced.