The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2000
Filed:
Nov. 26, 1997
Kiyonori Furuta, Kawasaki, JP;
Tadahiko Yokota, Kawasaki, JP;
Ajinomoto Co., Inc., Tokyo, JP;
Abstract
The problems are to provide a prepreg for laminate which can secure a heat resistance, electrical insulation properties and an adhesion strength of a conductor layer, a printed wiring-board which satisfies a high density and which is excellent in a heat resistance and electrical insulation properties upon utilizing the conventional production equipment and method of laminate pressing, and a process for producing the same. A prepreg for laminate characterized in that a paper-like or fabric-like substrate is impregnated with an epoxy resin composition capable of forming a roughened surface through roughening treatment, and a laminate obtained by using the same; a printed wiring-board obtained by using the printed wiring-board and a process for producing the same, which comprises (1) a step of forming a roughened surface by subjecting the surface of the laminate to the roughening treatment, and (2) a step of forming a conductor layer on the roughened surface of the laminate; and a multi-layer printed wiring-board and a process for producing the same, which comprises (1) a step of laminating the prepreg for laminate with an inner layer material such that the prepreg is disposed on the surface, and pressing them to form a laminate, (2) a step of subjecting the surface of the laminate to the roughening treatment to form a roughened surface, and (3) a step of forming a conductor layer on the roughened surface of the laminate.