The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2000
Filed:
Feb. 10, 1999
Hideaki Murata, Kanagawa, JP;
Takeshi Aikiyo, Chiba, JP;
Kazuto Ono, Tochigi, JP;
Masato Sakata, Tochigi, JP;
Yukio Kazama, Tochigi, JP;
The Furukawa Electric Co., Ltd., Tokyo, JP;
Abstract
A method of manufacturing an optical module package, which comprises the steps of, attaching a first member to a frame by means of silver-brazing to obtain a frame structure, applying an Au plating to the frame structure applied with the silver-brazing, and soldering a second member to the frame structure applied with the Au plating, wherein the method further comprises the steps of subjecting the frame structure to a high temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature of 340.degree. C. or more for 10 minutes or more after the silver-brazing step and before the Au plating step, and subjecting the frame structure to a low temperature dehydrogenation treatment of heating the frame structure in an non-oxidizing atmosphere at a temperature ranging from 240.degree. C. to 260.degree. C. for 5 minutes or more after the soldering step.