The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 2000
Filed:
Nov. 27, 1996
David K Biegelsen, Portola Valley, CA (US);
Warren B Jackson, San Francisco, CA (US);
Patrick C Cheung, Castro Valley, CA (US);
Mark H Yim, Palo Alto, CA (US);
Andrew A Berlin, San Jose, CA (US);
Xerox Corporation, Stamford, CT (US);
Abstract
Construction of fluid conduit systems in printed circuit boards or other dielectric laminate substrates is disclosed. The fluid conduits can be angled or curved to provide greater directional control of fluid flow. Conduits are created by lamination of a first laminate layer and a second laminate layer. The first laminate layer is composed of a dielectric base material impregnated with a resin, with a first aperture defined therethrough, while the second laminate layer has a second aperture. The second aperture is positioned with respect to the first aperture to only partially overlap, together defining an angled conduit. Fluid flow through the conduits can be controlled using microdevice valves.