The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2000
Filed:
May. 28, 1999
Applicant:
Inventors:
Matt John Banet, Boston, MA (US);
Robin Anne Sacco, Franklin, MA (US);
Assignee:
Philips Electronics North America Corporation, New York, NY (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01B / ;
U.S. Cl.
CPC ...
356381 ; 356382 ; 25055927 ;
Abstract
Film thickness variation is measured in a region determined to be particularly non-uniform. Preferably the region is a donut entirely disposed within 15 mm of the edge of the film. Preferably the measurements are effected by and ISTS apparatus. The method is particularly well adapted to copper films deposited by ECD.
Quick Actions:
Banet, Matt. (2000). Method for measuring thickness of films (U.S. Patent No. 6122064). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/6122064
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile