The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 19, 2000

Filed:

Jun. 29, 1999
Applicant:
Inventors:

Katsuhiko Ariga, Obu, JP;

Masayasu Teraoka, Chiryu, JP;

Yoshimitsu Motoki, Kami-Niikawagun, JP;

Ichiro Ishiyama, Kami-Niikawagun, JP;

Assignees:

Denso Corporation, Niikawagun, JP;

Hokuriku Electric Industry Co., Ltd., Niikawagun, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01C / ;
U.S. Cl.
CPC ...
338114 ; 338 47 ; 338 99 ; 338101 ; 338-5 ;
Abstract

Pressure sensitive layers are disposed on respective resin films through electrodes to face each other, and include high conductivity flaky carbon particles and low conductivity amorphous-based carbon particles. The two kinds of carbon particles are bound together by a resin-system binder. Accordingly, when a pushing force is applied to the resin films, an average distance between the carbon particles is decreased to cause a tunnel conduction phenomenon, resulting in a decrease in conductive resistance between the electrodes. As a result, a pressure sensing property can be made gentle.


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