Ball grid array package having through-holes disposed in the substrate

Abstract

Disclosed is a semiconductor device for improving a resistance against barrel cracks of an insulating substrate on which a semiconductor chip is mounted, thereby enhancing a reliability of the semiconductor device. A plurality of through-holes provided in a BGA substrate for electrically connecting electrodes of a semiconductor chip to packaging electrodes are arranged inside a region of the BGA substrate in which the semiconductor chip is mounted. When the semiconductor device undergoes temperature changes, a larger extension/contraction force is applied to the lower portion of the BGA substrate as compared with the upper portion thereof, and such an expansion/contraction force becomes larger at a position more apart from the center of the BGA substrate. As a result, a through-hole at a position more apart from the BGA substrate is applied to a larger stress. However, since the plurality of through-holes are arranged inside the region of the BGA substrate in which the semiconductor chip is mounted, the stress applied to each through-hole can be reduced. This is effective to suppress occurrence of barrel cracks.